There are several package types for Intel® processors. These different package types are illustrated below along with a brief explanation of how to easily identify them.
FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
Pentium III and Intel® Celeron® processor
OOI Package Type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate face-down for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.
FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.
PPGA Package Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
S.E.C.C. Package Type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
S.E.C.C.2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).
S.E.P. Package Type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.
Laptops:
Micro-FCPGA
The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.
Micro-FCBGA
Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.
Micro-BGA2 Package
The BGA2 package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The Pentium® III processor uses the BGA2 package, which contains 495 balls.
Micro-PGA2 Package
The micro-PGA2 consists of a BGA package mounted to an interposer with small pins. The pins are 1.25 mm long and 0.30 mm in diameter. While there are several micro-PGA2 socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the mobile Pentium III processor.
MMC-2 Package
The Mobile Module Cartridge 2 (MMC-2) package has a mobile Pentium® III processor and the host bridge system controller (consisting of the processor bus controller, memory controller and PCI bus controller) on a small circuit. It connects to the system via a 400-pin connector. On the MMC-2 package, the thermal transfer plate (TTP) provides heat dissipation from the processor and host bridge system controller.
Other Package Types
CPGA (Ceramic Pin Grid Array)
CPGA stands for Ceramic Pin Grid Array, a type of connection for CPUs where the processor's die is attached to a heat-conducting ceramic plate which is pierced by an array of pins which make the requisite connections to the socket.
Popular CPUs that employ CPGA are the "classic" Socket A Athlon and the Duron, both from AMD.
OPGA (Organic Pin Grid Array )
The Organic Pin Grid Array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.
A popular type of CPU to employ the OPGA is the AMD Athlon XP.
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